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[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP

Nakamura, Yukio, Oohashi, Kenichi, Morita, Koji, Nomoto, Shuji, Suzuki, Takayuki, Takanezawa, Shin, Tsuchikawa, Shinji, Takekoshi, Masaaki
Year:
2015
Language:
english
File:
PDF, 2.51 MB
english, 2015
19

Capacity of associative memory using a nonmonotonic neuron model

Shuji Yoshizawa, Masahiko Morita, Shun-Ichi Amari
Journal:
Neural Networks
Year:
1993
Language:
english
File:
PDF, 725 KB
english, 1993
22

High-power UV InGaN/AlGaN double-heterostructure LEDs

Mukai, Takashi, Morita, Daisuke, Nakamura, Shuji
Journal:
Journal of Crystal Growth
Year:
1998
Language:
english
File:
PDF, 103 KB
english, 1998